agilent hlmp-cwxx t-1 3 / 4 precision optical performance white led lamps data sheet description these high intensity white led lamps are based on ingan material technology. a blue led die is coated by a phosphor to produce white. the typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 cie chromaticity diagram. hlmp-cw15, hlmp-cw16, hlmp-cw23, hlmp-cw24, hlmp-cw30, hlmp-cw31 features highly luminous white emission ?5 , 23 , and 30 viewing angle applications electronic signs and signals small area illumination legend backlighting general purpose indicators benefit reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources these t-1 3? 4 lamps are untinted, nondiffused, and incorporate precise optics producing well defined spatial radiation patterns at specific viewing cone angle. caution: these devices are class 2 esd sensitive. please observe appropriate precautions during handling and processing. refer to agilent technologies application note an-1142 for additional details.
2 device selection guide min. luminous intensity viewing angle iv (mcd) @ 20 ma part number typ. min. max. standoff leads package dimension hlmp-cw15-tw0xx 15 2500 7200 no a hlmp-cw15-vy0xx 15 4200 12000 no a hlmp-cw16-tw0xx 15 2500 7200 yes b hlmp-cw16-vy0xx 15 4200 12000 yes b hlmp-cw23-sv0xx 23 1900 5500 no a hlmp-cw23-tw0xx 23 2500 7200 no a hlmp-cw24-sv0xx 23 1900 5500 yes b hlmp-cw24-tw0xx 23 2500 7200 yes b hlmp-cw30-ps0xx 30 880 2500 no a hlmp-cw30-sv0xx 30 1900 5500 no a hlmp-cw31-ps0xx 30 880 2500 yes b hlmp-cw31-sv0xx 30 1900 5500 yes b tolerance for each intensity limit is 15%.
3 package dimensions 1.14 ?0.20 (0.045 ?0.008) 5.80 ?0.20 (0.228 ?0.008) 5.00 ?0.20 (0.197 ?0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 ?0.20 (0.343 ?0.008) 2.54 ?0.38 (0.100 ?0.015) 0.50 ?0.10 (0.020 ?0.004) sq. typ. cathode lead cathode flat d 1.50 ?0.15 (0.059 ?0.006) package dimension b 1.14 ?0.20 (0.045 ?0.008) 5.80 ?0.20 (0.228 ?0.008) 5.00 ?0.20 (0.197 ?0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 ?0.20 (0.343 ?0.008) 2.54 ?0.38 (0.100 ?0.015) 0.50 ?0.10 (0.020 ?0.004) sq. typ. notes: 1. all dimensions are in millimeters (inches). 2. epoxy meniscus may extend about 1 mm (0.040") down the leads. cathode lead 2.35 (0.093) max. cathode flat package dimension a hlmp-cw24 d = 12.52 ?0.25 (0.493 ?0.010) hlmp-cw16 d = 12.6 ?0.25 (0.496 ?0.010) hlmp-cw31 d = 11.96 ?0.25 (0.471 ?0.010) part numbering system hlmp C cwxx - x x x xx mechanical option 00: bulk dd: ammo pack color bin option 0: full color bin distribution maximum intensity bin limit 0: no maximum intensity bin limit minimum intensity bin limit refer to device selection guide viewing angle and standoff option 15: 15 without standoffs 16: 15 with standoffs 23: 23 without standoffs 24: 23 with standoffs 30: 30 without standoffs 31: 30 with standoffs
4 absolute maximum ratings t a = 25?c parameter value units dc forward current [1] 30 ma peak forward current [2] 100 ma power dissipation 120 mw reverse voltage (i r = 10 a) 5 v led junction temperature 110 o c operating temperature range ?0 to +80 o c storage temperature range ?0 to +100 o c notes: 1. derate linearly as shown in figure 5. 2. duty factor 10%, 1 khz. electrical characteristics t a = 25 c forward voltage, reverse breakdown, capacitance, c (pf), thermal resistance v f (v) @ i f = 20 ma v r (v) @ i r = 10 av f = 0, f = 1 mhz rq j-pin ( c/w) typ. max. min. typ. typ. 3.6 4.0 5 70 240 optical characteristics t a = 25 c typical chromaticity viewing angle coordinates [1] 2 1/2 degrees [2] part number x y typ. hlmp-cw3x-xxxxx 0.32 0.32 30 hlmp-cw2x-xxxxx 0.32 0.32 23 hlmp-cw1x-xxxxx 0.32 0.32 15 notes: 1. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the devi ce. 2. 1/2 is the off-axis angle where the luminous intensity is 1 2 the peak intensity.
5 figure 6a. cw1x spatial radiation pattern. figure 1. relative intensity vs. wavelength. figure 3. relative lv vs. forward current. figure 5. maximum forward current vs. temperature. figure 4. chromaticity shift vs. current. wavelength ?nm relative luminous intensity 380 780 1.0 0.6 0 680 580 480 0.4 0.8 0.2 figure 2. forward current vs. forward voltage. i f forward current ma 2 0 v f forward voltage v 3.6 20 15 2.8 30 5 10 25 2.4 3.2 4.0 0 1.5 0.3 relative luminous intensity forward current ma 030 1.2 10 20 0.9 0.6 max. forward current ma 0 0 ambient temperature c 40 80 30 10 20 60 100 15 25 r j-a = 585 c/w r j-a = 780 c/w 5 20 relative intensity 1 0 angular displacement degrees 0.5 -90 -60 0 -30 30 60 90 -0.010 0.025 0 0.005 -0.005 y-coordinates x-coordinates (x,y) values @ 20 ma reference to (0,0) -0.004 0.004 -0.002 30 ma 5 ma 1 ma 0 0.002 0.015 0.010 0.020 25 ma 20 ma 15 ma 10 ma
6 figure 6b. cw2x spatial radiation pattern. relative luminous intensity 1 0 angular displacement degrees 0.5 -90 -60 0 -30 30 60 90 intensity bin limits (mcd at 20 ma) bin min. max. m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 tolerance for each bin limit is 15%. color bin limit table rank limits (chromaticity coordinates) 1 x 0.330 0.330 0.356 0.361 y 0.360 0.318 0.351 0.385 2 x 0.287 0.296 0.330 0.330 y 0.295 0.276 0.318 0.339 3 x 0.264 0.280 0.296 0.283 y 0.267 0.248 0.276 0.305 4 x 0.283 0.287 0.330 0.330 y 0.305 0.295 0.339 0.360 tolerance for each bin limit is 0.01. 0.40 0.35 0.30 0.25 0.20 0.26 0.30 0.34 0.38 y-coordinate x-coordinate 3 2 4 1 black body curve color bin limits with respect to cie 1931 chromaticity diagram note: bin categories are established for classification of products. products may not be available in all bin categories. please contact your agilent representative for information on currently available bins. figure 6c. cw3x spatial radiation pattern. relative luminous intensity 1 0 angular displacement degrees 0.5 -90 -60 0 -30 30 60 90
7 precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. ? recommended soldering conditions: manual solder wave soldering dipping pre-heat temperature 105 c max. pre-heat time 30 sec max. peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. ? if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25 c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. figure 7. recommended wave soldering profile. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time seconds temperature c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force.
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152 (domestic/interna- tional), or 0120-61-1280 (domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ?2005 agilent technologies, inc. obsoletes 5989-2806en october 20, 2005 5989-4125en
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